| 型号 | 厂家 | 封装 | 批号 |
| TLV70730PDQNR | TI | 4-XDFN 裸露焊盘 | 2020+ |
| TLV1117-33CDCYR | TI | TO-261-4，TO-261AA | 2020+ |
| IP4064CX8/LF/P135 | NXP | 8-WFBGA，WLCSP | 2020+ |
| IP4385CX4/LF | NXP | 4-UFBGA，WLCSP | 2020+ |
| MIC5213-3.3YC5-TR | MICREL | 5-TSSOP，SC-70-5，SOT-353 | 2020+ |
| MIC5305-3.0YD5-TR | MICREL | SOT-23-5 细型，TSOT-23-5 | 2020+ |
| SY58020UMGTR | MICREL | 16-VFQFN 裸露焊盘，16-MLF® | 2020+ |
| WM8994ECS/R | WOLFSON | 72-WFBGA，CSPBGA | 2020+ |
| PRF957 | NXP | SC-70，SOT-323 | 2020+ |
| PI49FCT3807DHEX | PERICOM | 20-SSOP（0.209"，5.30mm 宽） | 2020+ |
