| 型号 | 厂家 | 封装 | 批号 |
| XC6SLX75T-2FGG484 | Xilinx Inc. | 484-FBGA（23x23） | 2020+ |
| MAX211CAI-T | Maxim | 28-SSOP | 2020+ |
| NFM21CC222R1H3D | 0805（2012 公制） | ||
| VND5012AKTR-E | STMicroelectronics | 24-PowerBSOP（0.295"，7.50mm 宽） | 2020+ |
| DCC010-TB-E | ON | SC-96 | 2020+ |
| PC48F4400P0TB0E3 | Micron | 64-EasyBGA（10x13） | 2020+ |
| MAX813LCPA+ | Maxim | 8-PDIP | 2020+ |
| MT8888CSR1 | Microchip | 20-SOIC | 2020+ |
| 8532AY-01LF | Renesas | 52-TQFP（10x10） | 2020+ |
| SJA1000T | NXP USA Inc. | 28-SO | 2020+ |
