| 型号 | 厂家 | 封装 | 批号 |
| XPC860MHZP66C1 | MOTOROLA | BGA | 22+ |
| X84129S-AF | XICOR | SOIC-16 | 22+ |
| X84129 | XICOR | SOP | 22+ |
| X84129-S | XICOR | SMD-16 | 22+ |
| X84129S | XICOR | SOP-16 | 22+ |
| XR21V1410IL16-F | EXAR | QFN | 22+ |
| X1057-6402 | TI | DLP | 22+ |
| XC3SD3400A-5FGG676 | XILINX | BGA | 22+ |
| XRT65118ACP | EXAR | DIP-28 | 22+ |
| XMSS2Q3G0PA-068TMP | MURATA | SMD | 22+ |
