| 型号 | 厂家 | 封装 | 批号 |
| W25Q64CVSSIG | WinbondElectronics | 8-SOIC | 2022+ |
| WPN252012H100MT | Shenzhen | 2022+ | |
| W9812G6IH-6 | Winbond | 54-TSOP II | 2022+ |
| W9812G6JH-6I | Winbond | 54-TSOP II | 2022+ |
| W9825G6JH-6I TR | Winbond | 54-TSOP II | 2022+ |
| W9864G6IH-6 | Winbond | 54-TSOP II | 2022+ |
| W9864G6JH-6I | Winbond | 54-TSOP II | 2022+ |
| WM9713CLGEFL/RV | Cirrus Logic Inc. | 48-QFN（7x7） | 2022+ |
| WM8978CGEFL/RV | Cirrus Logic Inc. | 32-QFN（5x5） | 2022+ |
| WM8960CGEFL/RV | Cirrus Logic Inc. | 32-QFN（5x5） | 2022+ |
