| 型号 | 厂家 | 封装 | 批号 |
| K8D6316UBM-TI07 | SAMSUNG | BGA | 22+ |
| KS8993 | KENDIN | QFP | 22+ |
| K4T1G1640E-HCE7 | SAMSUNG | BGA | 22+ |
| K4T1G084QF-BCE6000 | SAMSUNG | BGA | 22+ |
| K4T1G164QF-BCE6 | SAMSUNG | BGA | 22+ |
| K8D3216UBB-YI07 | SAMSUNG | TSOP | 22+ |
| K4S643232C-TL80 | SAMSUNG | TSOP | 22+ |
| K4S641632F-TC60 | SAMSUNG | TSOP | 22+ |
| K4S641633H-BN75 | SAMSUNG | BGA | 22+ |
| K4S643233H-HN75 | SAMSUNG | BGA | 22+ |
