| 型号 | 厂家 | 封装 | 批号 |
| K4M513233C-DN75 | SAMSUNG | BGA | 22+ |
| K4M56323PI-HG75 | SAMSUNG | BGA | 22+ |
| KID65783AP/PN | KEC实50K | DIP-18 | 22+ |
| K9G4G08UOB-PCBO | 三星Samsung | TSOP48 | 22+ |
| K9F2G08U0A-PCB0 | 三星Samsung | TSOP48 | 22+ |
| K4X56323PG-8GC6 | 三星Samsung | FBGA | 22+ |
| K4W1G0846S-GC15 | 三星Samsung | FBGA | 22+ |
| K4T1G164QG-BIE6 | 三星Samsung | FBGA | 22+ |
| K4S561632E-TC75 | 三星Samsung | TSOP54 | 22+ |
| K4R271669H-DCS8 | 三星Samsung | FBGA | 22+ |
